99.7% Alumina Wafer Polish Plate

Short Description:

Chemshun 99.7%Al2O3 Alumina substrate as a high purity material and the large size new material, it has excellent physical properties and stable chemical characters, the good price compare with other materials. High purity alumina is always continued developing by the global top research and advanced ceramics and fine ceramic factories.

99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing. As an important component of CMP chemical mechanical polishing process. CMP is the necessary for producing process of the sapphire and Wafer of the semiconductors.

Chemshun Ceramics’ high purity 99.7 % alumina ceramics sapphire polishing and lapping plates, Disc are shaped as PIBM producing process. Its an internaltional advanced technology. PIBM sucessful solve the key problem of crack and deformation of large size alumina ceramics.PIBM technology will open another window of fine ceramics.

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Product Detail

Application

As the Alumina ceramic wafer polishing and sapphire lapping disks used in the semi-conductive, diamond polishing etc.

Process: All types of Polishing and lapping process, such as CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.

Feature

High purity and chemical durability
High Mechanical Strength and Hardness
High Corrosion Resistance
High Voltage Resistance
High Temperature Resistant Up to 1700ºC
Extremely Abrasion Resistance Performance
Excellent Insulation Performance
All type of Size 180,360, 450, 600mm etc

Product name	99.7 high purity Alumina ceramic Polishing Lapping Discs
Material	99.7% alumina
Normal Size	D180, 360, 450, 600mm, customized size accepted.
Color	Ivory
Application	Wafer and Sapphire CMP process in semi-conductive industry
Min.Order	1Pic

Chemical / physical Information

		Unit	99.7 Alumina Ceramics
General Properties	Al2O3 content	wt%	99.7-99.9
	Density	gm/cc	3.94-3.97
	Color	-	Ivory
	Water absorption	%	0
Mechanical Properties	Flexural Strength(MOR) 20 ºC	Mpa(psix10^3)	440-550
	Elastic Modulus 20ºC	GPa (psix10^6)	375
	Vickers Hardness	Gpa(kg/mm2) R45N	>=17
	Bending Strength	Gpa	390
	Tensile Strength 25ºC	MPa(psix10^3)	248
	Fracture Toughness (K I c)	Mpa* m^1/2	4-5
Thermal Properities	Thermal conductivity(20ºC)	W/mk	30
	Coefficient of Thermal expansion(25-1000ºC)	1x 10^-6/ºC	7.6
	Thermal Shock Resistance	ºC	200
	Maximum use temperature	ºC	1700
Electrical Properities	Dielectric Strength (1MHz)	ac-kv/mm(ac v/mil)	8.7
	Dielectric Constant(1 MHz)	25ºC	9.7
	Volume Resistivity	ohm-cm (25ºC)	>10^14
		ohm-cm (500ºC)	2×10^12
		ohm-cm (1000ºC)	2×10^7

Service

We accept custom orders.
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