Polishing pads play a crucial role as a precision machining tool in the fields of materials science and surface engineering. Their function is to polish the surface of the material by physical or chemical means in order to achieve the desired finish and surface properties. Depending on the application requirements, polishing discs are available in a variety of materials, such as diamond, alumina, silicon carbide, etc., each of which has its own unique grinding characteristics and scope of application.
In the field of semiconductor manufacturing, polished wafers are particularly critical, especially in the chemical mechanical polishing (CMP) process, which is used to achieve high-precision flattening of the wafer surface.CMP technology combines mechanical grinding and chemical etching, effectively solving the irregularities of the wafer’s micro-geometry, thus guaranteeing the performance and reliability of microelectronic components.
In the field of metal processing, polishing pads are used to remove oxidized layers and contaminants from the surface of workpieces as well as to improve surface finish, thereby enhancing the appearance and performance of materials. For example, in the aerospace and automotive industries, where the surface treatment of components is extremely demanding, polishing can significantly improve the corrosion resistance and fatigue life of products.
For different materials and processing requirements, parameters such as grain size, hardness and shape of the polishing disk need to be carefully designed. The choice of grain size directly affects the surface roughness, while the hardness determines the removal rate of the polishing process and the durability of the tool. In addition, the pressure, speed and environmental conditions of the polishing process need to be strictly controlled to ensure that the desired surface quality is achieved.
Chemshun Ceramics Company is a professional industrial ceramics manufacturer, 99.7% Alumina Wafer Polishing Discs can be supplied. Welcome to inquire.
Post time: Jul-28-2024